松下机电上调PCB基板材料价格，电子布下游半成品等最高涨30%

智通财经08-28

【松下机电上调PCB基板材料价格，电子布下游半成品等最高涨30%】8月28日，松下机电已于8月6日发布通知称，将对电子线路板材料进行价格调整，自2026年9月1日起出货产品开始执行，部分产品涨幅最高达到30%。据了解，此次调价涉及覆铜板、半固化片等多类电子线路板材料。其中，普通多层板材料的覆铜板和半固化片均涨价30%；MEGTRON、XPEDION低损耗材料的覆铜板和半固化片均涨价15%；...

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