苹果史上最高互连密度：曝 M6 Pro / Max 芯片仍在推进，首次采用台积电双封装组合

IT之家08-28 10:27

IT之家 8 月 28 日消息，工商时报昨日（8 月 27 日）发布博文，爆料称苹果公司可能并未跳过 M6 Pro 和 M6 Max 两款芯片研发。IT之家此前援引马克 · 古尔曼（Mark Gurman）爆料，称苹果公司计划调整 M6 和 M7 系列芯片规划，跳过 M6 Pro 和 M6 Max，转而把研发重心放在更注重 AI 计算的 M7 系列芯片。不过最新消息称苹果公司仍在推进 M6 Pro...

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