硅宝科技：TIM1界面导热材料目前尚处于验证阶段

证券之星08-14

证券之星消息，硅宝科技(300019)08月14日在投资者关系平台上答复投资者关心的问题。

投资者提问：贵公司研发的高性能半导体封装材料，是否已经量产，以及TIM1产品是否形成稳定收入

硅宝科技回复：尊敬的投资者，您好！公司研发的TIM1界面导热材料，具备优异的导热性以及间隙变化耐受性。上述产品目前尚处于验证阶段，暂未形成稳定销售。公司将积极推进产品验证进程，拓展行业客户。感谢您对硅宝科技的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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