富乐德：拟发行不超11.76亿元可转债用于半导体设备精密再生及陶瓷封装载板等项目

格隆汇08-14 20:22

富乐德(301297.SZ)公告称，公司拟向不特定对象发行可转换公司债券，募集资金总额不超过11.76亿元，扣除发行费用后拟用于大连富乐德精密洗净及再生服务产线建设项目、半导体设备精密再生及陶瓷封装载板项目(一期)、半导体设备高制程精密部件年修复40万件项目等7个项目。

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富乐德：拟发行不超11.76亿元可转债 用于半导体设备精密再生及陶瓷封装载板等项目

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富乐德：拟发行不超11.76亿元可转债用于半导体设备精密再生及陶瓷封装载板等项目