展芯股份：拥有专业封装设计团队

证券之星08-12 11:36

证券之星消息，C展芯(301707)08月11日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘你好，请问公司在半导体先进封装领域有哪些布局？

C展芯回复：尊敬的投资者，公司拥有专业封装设计团队，对封装工艺具有深刻理解，构建了公司与其他芯片设计企业的差异化竞争壁垒。目前已广泛应用于弹载、机载、船舶、地面等武器装备平台。感谢您的关注。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：陈思雨

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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