北京君正：目前在研主要面向端侧AI应用的3D DRAM产品

证券之星08-12

证券之星消息，北京君正(300223)08月12日在投资者关系平台上答复投资者关心的问题。

投资者提问：公司管理层你好，公司有计划发行港股募资投研发高速交换芯片吗，未来高速电交换芯片紧缺。AI服务器HBM存储芯片有能力研发出来吗

北京君正回复：您好！公司会根据市场及公司情况进行研发规划，公司没有HBM芯片的研发计划，目前在研主要面向端侧AI应用的3D DRAM产品。谢谢！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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