公司问答丨飞凯材料：公司发布的Ultra Low Alpha Microball最小直径低至50μm 可助力解决先进封装用基板的材料瓶颈

格隆汇08-10 15:58

有投资者在互动平台向飞凯材料提问，最近看有爆料长鑫LPDDR6封装提到1295焊球，贵公司生产的锡球在国内同行业中处于什么地位？飞凯材料回复称，公司发布的Ultra Low Alpha Microball(超低阿尔法微球)最小直径低至50μm，可助力解决先进封装用基板的材料瓶颈。

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