臻宝科技：拟用2.5亿元超募资金投建半导体零部件项目

格隆汇08-07

臻宝科技公告称，全资子公司武汉臻宝拟使用2.5亿元超募资金投资新建“半导体零部件研发生产基地项目”，项目总投资5.2亿元，建设周期3年。该议案已通过董事会审议，尚需股东会批准。项目旨在提升高精密零部件本土供给规模、突破产能瓶颈、绑定客户，不过存在技术与客户验证、项目进程及效益、备案审批等风险。

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