CoWoS封装产能告急台积电进一步扩大外包产能

格隆汇08-04 19:30

据市场消息，英伟达的GPU订单已经把台积电的封装产线挤到极限，台积电不得不决定将AI芯片制造核心工席CoWos中的CoW(晶圆上芯片)封装产能进一步外包给日月光等封测厂商。CoWoS是台积电用于AI芯片的2.5D封装技术，AI处理器位于芯片中心，HBM(高带宽内存)环绕四周，通过中介层连接。

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2656555878?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2026-08-04 19:30","share_image_url":"https://static.laohu8.com/6b8fa6424aebe95f6781d04ef17a1852","id":"2656555878","market":"us","top_or_hot":-1,"title":"CoWoS封装产能告急 台积电进一步扩大外包产能","media":"格隆汇","content":"<html><body>据市场消息，英伟达的GPU订单已经把台积电的封装产线挤到极限，台积电不得不决定将AI芯片制造核心工席CoWos中的CoW(晶圆上芯片)封装产能进一步外包给日月光等封测厂商。CoWoS是台积电用于AI芯片的2.5D封装技术，AI处理器位于芯片中心，HBM(高带宽内存)环绕四周，通过中介层连接。</body></html>","source":"live_gelonghui","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>CoWoS封装产能告急 台积电进一步扩大外包产能</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nCoWoS封装产能告急 台积电进一步扩大外包产能\n</h2>\n\n<h4 class=\"meta\">\n\n</h4>\n\n</header>\n<article>\n<html><body>据市场消息，英伟达的GPU订单已经把台积电的封装产线挤到极限，台积电不得不决定将AI芯片制造核心工席CoWos中的CoW(晶圆上芯片)封装产能进一步外包给日月光等封测厂商。CoWoS是台积电用于AI芯片的2.5D封装技术，AI处理器位于芯片中心，HBM(高带宽内存)环绕四周，通过中介层连接。</body></html>\n\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.gelonghui.com/rss/live/live.xml\">格隆汇</a> </p>\n\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n</div>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":null,"symbol_name":null,"start_time":0,"source_url":"https://www.gelonghui.com/rss/live/live.xml","article_id":"2656555878","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2656555878","pubTimestamp":1785843028,"columns":[],"sourceInfo":{"source_id":"live_gelonghui","name":"格隆汇"},"weMediaInfo":null,"summary":"据市场消息，英伟达的GPU订单已经把台积电的封装产线挤到极限，台积电不得不决定将AI芯片制造核心工席CoWos中的CoW(晶圆上芯片)封装产能进一步外包给日月光等封测厂商。CoWoS是台积电用于AI芯","collect":0,"end_time":0,"defaultTopTitle":"gelonghui.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{},"translate_title":"CoWoS Packaging Capacity in Emergency TSMC Further Expands Outsourcing Capacity","themeId":null,"isJumpTheme":false,"ttsUrl":"https://static.tigerbbs.com/6960d76f3660208259c6d32c45e87eb9","symbols_score_info":{"USXF":0.6,"SOXX":0.6,"TINS":0.6,"NVDW":0.6,"TSMU":0.6,"EMC":0.6,"AGOX":0.6,"IETC":0.6,"UMMA":0.6,"CGDG":0.6,"TYLG":0.6,"FAI":0.6,"ANV":0.6,"ROM":0.6,"SHOC":0.6,"NVDS":0.6,"CORO":0.6,"FDTX":0.6,"NVYY":0.6,"ESIM":0.6,"TSMX":0.6,"AVXC":0.6,"CLSE":0.6,"ADVE":0.6,"DIPS":0.6,"ESLG":0.6,"KNOW":0.6,"MEMX":0.6,"CGNG":0.6,"NVDX":0.6,"BLOX":0.6,"EFIV":0.6,"NVDY":0.6,"NULC":0.6,"THMR":0.6,"NVDS.UK":0.6,"SNPE":0.6,"SMHX":0.6,"NVDG":0.6,"SOXQ":0.6,"STSM":0.6,"NVDL":0.6,"NVDA":1.81,"NVD":0.6,"CGGO":0.6,"LFGY":0.6,"BAI":0.6,"AIFD":0.6,"VGT":0.6,"ESUM":0.6,"NVDQ":0.6,"ABFL":0.6,"NVD2.UK":0.6,"NVDB":0.6,"USD":0.6,"METV":0.6,"03145":0.6,"ILDR":0.6,"NVDO":0.6,"FTEC":0.6,"SNVD.UK":0.6,"VT":0.6,"NVDD":0.6,"TSMG":0.6,"EMM":0.6,"SPWO":0.6,"NVD3.UK":0.6,"TSMY":0.6,"TTXU":0.6,"TTEQ":0.6,"TSM":1.97,"CHPX":0.6,"CGIC":0.6,"3NVD.UK":0.6,"07788":0.6,"AIQ":0.6,"JGRO":0.6,"NVDU":0.6,"CWI":0.6,"WISE":0.6,"AVSE":0.6,"SPTE":0.6,"XLK":0.6,"TEK":0.6,"ASIA":0.6,"NVII":0.6,"07388":0.6,"AVEM":0.6,"SMH":0.6,"2NVD.UK":0.6,"CHAT":0.6,"CNEQ":0.6,"TSMZ":0.6,"CMAG":0.6,"NVIW.SI":0.6,"SOXY":0.6,"TRFK":0.6,"AIPI":0.6,"ARTY":0.6,"WUGI":0.6,"IXN":0.6,"GAMR":0.6},"content_text":"据市场消息，英伟达的GPU订单已经把台积电的封装产线挤到极限，台积电不得不决定将AI芯片制造核心工席CoWos中的CoW(晶圆上芯片)封装产能进一步外包给日月光等封测厂商。CoWoS是台积电用于AI芯片的2.5D封装技术，AI处理器位于芯片中心，HBM(高带宽内存)环绕四周，通过中介层连接。","kind":"live","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":true,"is_publish_wemedia":false,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"isLaohu8Offline":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.44.1","shortVersion":"4.44.1","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2656555878","isCrawlerRequest":true}

CoWoS封装产能告急 台积电进一步扩大外包产能

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CoWoS封装产能告急台积电进一步扩大外包产能