联得装备：公司半导体设备均为芯片封测后端设备

证券之星08-04

证券之星消息，联得装备(300545)08月04日在投资者关系平台上答复投资者关心的问题。

投资者提问：刘总好！请问公司的半导体设备中，哪些可以适配到长鑫科技的产业链中？谢谢

联得装备回复：投资者您好，公司半导体设备均为芯片封测后端设备，暂不涉及长鑫科技晶圆制造前道所需工艺设备。感谢您对联得装备的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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