基本半导体与汉磊科技达成战略合作，加快8英寸碳化硅晶圆开发及量产

财中社08-04

8月4日，基本半导体（09971）发布公告，公司已与汉磊科技股份有限公司达成战略合作。　　此次战略合作，双方将在之前长期合作的基础上，加快8英寸碳化硅晶圆的开发及量产。基于公司半导体的先进产品技术和市场优势以及汉磊科技高质量大规模晶圆制造能力，共同推进新工艺平台开发和量产落地，提升碳化硅产品在新能源汽车、AI算力中心等领域的市场份额。（文章来源：财中社）

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