有研新材最新公告：拟4.86亿元投建集成电路用高纯溅射靶材二期扩建项目

证券之星07-30

有研新材(600206.SH)公告称，公司计划投资4.86亿元建设集成电路用高纯溅射靶材二期扩建项目，新增高纯铜系靶、钽靶、钛靶产能3万块/年，项目计划于2026年9月启动，2027年9月投产。

以上内容为证券之星据公开信息整理，仅供参考不构成投资建议。

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