同兴达：子公司日月同芯封测项目主要是显示驱动芯片金凸块全流程封装测试项目

证券之星07-29

证券之星消息，同兴达(002845)07月28日在投资者关系平台上答复投资者关心的问题。

投资者提问：公司先进封装包不包括手机OLED折叠屏，笔记本电脑的OLED触控屏

同兴达回复：您好，感谢对我司的关注。我司子公司日月同芯封测项目主要是显示驱动芯片金凸块全流程封装测试项目，可应用于手机和电脑领域，谢谢！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：陈思雨

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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