友达：已在先进封装、玻璃基板两大核心领域完成前期布局

格隆汇07-31

友达董事长彭双浪首次公开透露，目前友达已在先进封装、玻璃基板两大核心领域完成前期布局，并联合行业合作伙伴开展协同研发开发，相关合作方信息暂未对外披露。据悉，友达董事会已于昨日审议通过86.41亿元新台币的资本开支规划。本次大额资本投入将重点用于建设玻璃通孔(TGV)、重布线层(RDL)生产线及玻璃基板试产线。

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