将跨界做半导体封装?TCL华星赵军：处于技术论证开发阶段，预计下半年展示样品，并启动中试线开发平台筹建

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专题：2026ChinaJoy 　　新浪科技讯 7月31日中午消息，近日，2026 ChinaJoy举办。期间，TCL华星CEO赵军与新浪科技等媒体展开对话。　　当提到“是否会从面板跨界到半导体封装”，赵军表示，对TCL华星来讲目前还处于一个技术论证和前期开发的阶段，“显示面板制造与半导体先进封装，在核心工艺上确实有很强的协同性，主要体现在大尺寸玻璃基板处理、薄膜沉积、光刻、蚀刻以及自动化搬运等...

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