研报掘金丨东吴证券：维持蓝思科技“买入”评级，携手Intel布局TGV先进封装

格隆汇07-27

东吴证券研报指出，蓝思科技携手Intel布局TGV先进封装，打开半导体成长空间。双方将围绕玻璃基板穿孔成型、高精度激光加工、金属化通孔沉积及多层互连布线等关键工艺开展讨论与评估；Intel将提供说明性架构信息、DFM指南、基准测试方法和验证方法。本次合作是蓝思将玻璃精密加工技术积累玻璃能力向半导体先进封装延伸的重要进展：通过接入Intel的架构和验证体系，有望推动公司向高附加值封装工艺拓展，并...

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohunote.com/m/news/2654094014?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2026-07-27 14:19","share_image_url":"https://static.laohu8.com/6b8fa6424aebe95f6781d04ef17a1852","id":"2654094014","market":"sh","top_or_hot":-1,"title":"研报掘金丨东吴证券：维持蓝思科技“买入”评级，携手Intel布局TGV先进封装","media":"格隆汇","content":"<div>\n<p>东吴证券研报指出，蓝思科技携手Intel布局TGV先进封装，打开半导体成长空间。双方将围绕玻璃基板穿孔成型、高精度激光加工、金属化通孔沉积及多层互连布线等关键工艺开展讨论与评估；Intel将提供说明性架构信息、DFM指南、基准测试方法和验证方法。本次合作是蓝思将玻璃精密加工技术积累玻璃能力向半导体先进封装延伸的重要进展：通过接入Intel的架构和验证体系，有望推动公司向高附加值封装工艺拓展，并...</p>\n\n<a href=\"https://www.gelonghui.com/rss/live/live.xml\">网页链接</a>\n\n</div>\n","source":"live_gelonghui","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>研报掘金丨东吴证券：维持蓝思科技“买入”评级，携手Intel布局TGV先进封装</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n研报掘金丨东吴证券：维持蓝思科技“买入”评级，携手Intel布局TGV先进封装\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-07-27 14:19 北京时间&nbsp;&nbsp;&nbsp;<a href=https://www.gelonghui.com/rss/live/live.xml><strong>格隆汇</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>东吴证券研报指出，蓝思科技携手Intel布局TGV先进封装，打开半导体成长空间。双方将围绕玻璃基板穿孔成型、高精度激光加工、金属化通孔沉积及多层互连布线等关键工艺开展讨论与评估；Intel将提供说明性架构信息、DFM指南、基准测试方法和验证方法。本次合作是蓝思将玻璃精密加工技术积累玻璃能力向半导体先进封装延伸的重要进展：通过接入Intel的架构和验证体系，有望推动公司向高附加值封装工艺拓展，并...</p>\n\n<a href=\"https://www.gelonghui.com/rss/live/live.xml\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK0196","symbol_name":"行业龙头","start_time":0,"source_url":"https://www.gelonghui.com/rss/live/live.xml","article_id":"2654094014","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2654094014","pubTimestamp":1785133145,"columns":[],"sourceInfo":{"source_id":"live_gelonghui","name":"格隆汇"},"weMediaInfo":null,"summary":"东吴证券研报指出，蓝思科技携手Intel布局TGV先进封装，打开半导体成长空间。双方将围绕玻璃基板穿孔成型、高精度激光加工、金属化通孔沉积及多层互连布线等关键工艺开展讨论与评估；Intel将提供说明性","collect":0,"end_time":0,"defaultTopTitle":"gelonghui.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"300433":"蓝思科技","601555":"东吴证券","BK0196":"行业龙头","BK0064":"蓝宝石","BK0201":"可转债","BK0028":"国家队","BK0276":"资本市场","LU1979443071.USD":"AB CHINA A SHARES EQUITY PORTFOLIO \"AD\" (USDHDG) INC","SGXZ49509284.SGD":"United China A Shares Innovation A Acc SGD","LU1934453819.USD":"AB CHINA A SHARES EQUITY PORTFOLIO \"A\" (USD) ACC","BK0012":"证金概念","BK0076":"特斯拉","BK0009":"债转股","SGXZ81163826.USD":"UNITED CHINA A-SHARES INNOVATION \"A\" (USD) ACC","BK0183":"MSCI概念","BK0188":"融资融券","BK0214":"IT设备","BK0072":"苹果"},"translate_title":"Research Nuggets | Soochow Securities: Maintain the \"Buy\" rating of Lens Technology and join hands with Intel to lay out TGV advanced packaging","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"300433":1.5,"601555":1.5},"content_text":"东吴证券研报指出，蓝思科技携手Intel布局TGV先进封装，打开半导体成长空间。双方将围绕玻璃基板穿孔成型、高精度激光加工、金属化通孔沉积及多层互连布线等关键工艺开展讨论与评估；Intel将提供说明性架构信息、DFM指南、基准测试方法和验证方法。本次合作是蓝思将玻璃精密加工技术积累玻璃能力向半导体先进封装延伸的重要进展：通过接入Intel的架构和验证体系，有望推动公司向高附加值封装工艺拓展，并进一步提升公司在AI终端与数据中心硬件产业链中的参与度。考虑到公司在精密玻璃加工等领域具备深厚技术积累，与Intel合作有望加快TGV先进封装业务的客户验证及产业化进程，同时AIPC、数据中心硬件、智能装备等新业务持续拓展，有望打开中长期成长空间。当前股价对应PE为46/30/24倍，维持“买入”评级。","kind":"live","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":true,"is_publish_wemedia":false,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"isLaohu8Offline":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.44.1","shortVersion":"4.44.1","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2654094014","isCrawlerRequest":true}