联得装备：公司半导体设备主要集中在芯片封装测试设备领域

证券之星07-22

证券之星消息，联得装备(300545)07月22日在投资者关系平台上答复投资者关心的问题。

投资者提问：尊敬的董秘您好！公司半导体封测设备能否应用于存储芯片领域？谢谢！

联得装备回复：投资者您好，公司目前在半导体行业领域的设备主要集中在芯片封装测试设备领域，主要有显示驱动芯片ILB倒装机、半导体倒装机、软焊料固晶机、共晶固晶机、贴膜机、引线框架检测机等高速高精的半导体装备。在先进封装制程和第三代半导体相关设备领域，在市场和技术等方面，公司也正在布局拓展。公司将持续加大对半导体的研发投入，进一步完善新业务板块产业布局，推动公司半导体设备业务板块的发展。感谢您的关注和支持！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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