公司问答丨回天新材：underfill、edgebond、TIM、LID粘接等半导体封装系列产品已在多家行业头部客户处测试或供货目前业务占比较小

格隆汇07-24

有投资者在互动平台向回天新材提问，1、公司Underfill、TIM导热胶等先进封装材料，目前已经实现批量供货的客户包含哪些国内封测厂商(长电/通富/华天等)？目前处于小批量送样、小批量供货还是稳定大批量供货阶段？ 2、半导体封装胶2026上半年营收大约规模多少，营收占比是否持续提升？ 3、有没有提前做好半导体封装胶量产的准备？ 4、7.2万吨锂电负极胶项目建设进度，预计何时建成、产能爬坡时间？ ...

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公司问答丨回天新材：underfill、edgebond、TIM、LID粘接等半导体封装系列产品已在多家行业头部客户处测试或供货 目前业务占比较小

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公司问答丨回天新材：underfill、edgebond、TIM、LID粘接等半导体封装系列产品已在多家行业头部客户处测试或供货目前业务占比较小