中信建投：AI驱动PCB需求升级，感光干膜加速高端化与国产化

智通财经07-20

【中信建投：AI驱动PCB需求升级，感光干膜加速高端化与国产化】中信建投研报指出，感光干膜是PCB电路图形转印的核心耗材之一，当前全球PCB及封装基板已经进入一轮由AI服务器、数据中心和高速网络设备驱动的结构性增长周期，我们预计2026-2030年感光干膜市场空间分别为95/104/113/124/136亿元，对应2025-30年CAGR约为9.4%。当前全球感光干膜主要以中国台湾、日本企业主导，由于头部PCB企业已经开始批量采用国产感光干膜，且下游PCB产能集中在中国，预计内资感光干膜市场份额将持续提升。

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