时代新材：聚酰亚胺浆料用于柔性显示与半导体封装

证券之星07-17 18:12

证券之星消息，时代新材(600458)07月17日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘你好！请问公司研发的新材料聚酰亚胺，是否在功率半导体封装领域已经产生了营收？

时代新材回复：尊敬的投资者，您好！公司聚酰亚胺浆料产品主要应用于柔性显示与半导体封装领域，满足柔性显示面板、功率半导体耐高温、绝缘等性能需求。目前相关产品已与国内头部显示面板公司、功率半导体公司合作开展产品验证测试，部分产品已经通过验证，预计在年内有望取得市场订单。感谢您的关注！

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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