德龙激光：硅晶圆激光隐切设备已于2025年获得存储芯片头部厂商的订单

证券之星07-13 15:37

证券之星消息，德龙激光(688170)07月13日在投资者关系平台上答复投资者关心的问题。

投资者提问：尊敬的董秘，您好！请问贵司目前向长江存储是否已经实现了晶圆隐切设备的批量供货？另外针对长鑫存储的相关验证进展如何？谢谢！

德龙激光回复：尊敬的投资者您好！公司的硅晶圆激光隐切设备（SDBG）已于2025年获得存储芯片头部厂商的订单，并在今年初获得了小批量复制订单。公司持续在进行该产品的技术迭代和市场推广。感谢您对德龙激光的关注！

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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