福耀玻璃：公司没有参与半导体行业的芯片基板生产项目

证券之星07-14

证券之星消息，福耀玻璃(600660)07月14日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问贵公司有无参与生产芯片基板的项目呢？

福耀玻璃回复：您好，感谢您的提问，公司没有参与半导体行业的芯片基板生产项目。公司的主营业务是为各种交通运输工具提供安全玻璃和汽车饰件全解决方案，公司不断拓展“一片玻璃”的边界，加强对汽车玻璃智能、集成趋势的研究，持续加大研发投入，不断提升公司综合竞争力。

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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