迈为股份：晶圆混合键合设备对准精度提升至30nm@3σ

证券之星07-15

证券之星消息，迈为股份(300751)07月15日在投资者关系平台上答复投资者关心的问题。

投资者提问：HBM是AI算力核心存储，长鑫大力布局HBM量产，公司混合键合设备是3D堆叠必备设备，能否介绍与长鑫在HBM工艺联合研发进展，是否同步迭代下一代设备？

迈为股份回复：投资者您好，在键合工艺设备领域，公司的晶圆混合键合设备经研发团队持续创新，成功开发全新对准方案，将对准精度从50nm@3σ提升至30nm@3σ，达到国内领先、国际先进的技术水平。该设备已应用于 3D IC、异质异构集成等先进封装工艺，实现超高密度芯片堆叠与互连，助力客户加速突破先进封装技术瓶颈。此外，公司基于混合键合工艺首创了3D封装成套工艺设备解决方案，已与多家客户签订整线订单，计划于今年完成交付。该方案涵盖晶圆减薄、激光开槽、等离子体切割、等离子活化和亲水性处理及混合键合等全套设备及工艺，将助力客户构建完整先进封装产线，全面提升量产竞争力。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

相关 ETF

责任编辑：陈思雨

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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