三星电子遭遇人力荒拟将部分芯片后端设计外包

智通财经07-15 20:14

【三星电子遭遇人力荒拟将部分芯片后端设计外包】三星电子正考虑将谷歌TPU I/O芯片的后端设计工作外包；公司正考虑与AD Technology、Gaonchips、Alphachips三家韩国本土半导体设计服务公司合作。一位业内人士表示：“由于台积电的产能已达极限，一些无法处理的订单也涌向了三星电子。”

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三星电子遭遇人力荒 拟将部分芯片后端设计外包

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三星电子遭遇人力荒拟将部分芯片后端设计外包