洲明科技：率先突破巨量转移技术难题

证券之星07-16

证券之星消息，洲明科技(300232)07月16日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好，公司在Mini/Micro LED领域，Micro灯珠与Micro IC实现自主设计，并具备半导体封装能力。请问：1）常规LED芯片是否仍以外购为主？2）自研芯片目前自供比例多少、产能规模如何？3）驱动芯片等是否全部自研，有无对外采购情形？

洲明科技回复：您好！公司持续在Micro LED技术领域发力，通过自主研发、战略投资以及资源整合，构建了从Micro灯珠自主设计、Micro IC协同设计、半导体级器件封测到智能产品制造的完整产业链布局。公司率先突破巨量转移技术难题，实现了Micro LED 30/50微米×50/70微米无衬底技术0202（0.2mm×0.2mm）芯片封装，并量产P0.4间距MIP显示产品。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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