四会富仕：公司暂无半导体封装基板交付

证券之星07-13

证券之星消息，四会富仕(300852)07月13日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司有半导体封装基板产品吗？有相关技术储备吗？谢谢！

四会富仕回复：尊敬的投资者您好，公司暂无半导体封装基板交付。感谢您的关注，谢谢。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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