消息称三星电子正开发“2.xD”封装技术

智通财经07-10

【消息称三星电子正开发“2.xD”封装技术】据报道，为解决功耗和散热问题，三星正重点研发“2.xD”封装技术。据介绍，2.xD在现有基于硅中介层的封装基础上，通过应用基于面板的重分布层中介层，将HBM、逻辑芯片和硅光子技术集成到单个系统中，将发展成为用于人工智能数据中心的高容量、高带宽系统封装。

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