东北证券：散热结构趋于精密复杂 MIM工艺有望快速渗透

智通财经07-09

智通财经APP获悉，东北证券发布研报称，当前主流液冷存在渗漏风险高、热阻高、散热效率受限以及大批量生产成本高、良率不稳的行业痛点，随着芯片制程向更极限推进，晶体管密度的增速显著放缓，单晶体管功耗不再下降。片上晶体管数目增加，必然导致单芯片功耗增加。散热方案持续迭代是必然趋势，该行看好MIM工艺的渗透率快速上升。东北证券主要观点如下：当前主流液冷结构件采用CNC分体加工+钎焊、铝合金压铸、钣金拼接...

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