长芯博创：可支持半导体晶圆制造、先进封装、封测产线的机器视觉检测场景

证券之星07-10 16:21

证券之星消息，长芯博创(300548)07月10日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好，请问长芯博创的工业互联类高速互连产品（消费及工业有源光缆AOC、机器视觉用高速光缆、工业级光电模组、电子芯片），目前是否可以应用到第三代半导体晶圆厂、先进封装、封测产线的设备间高速数据互联或机器视觉传输介质领域？

长芯博创回复：感谢您对公司的关注！公司消费及工业互联产品应用领域包括机器视觉系统、虚拟现实、家庭影院、高清视频会议系统以及医疗影像系统等领域，可支持半导体晶圆制造、先进封装、封测产线的机器视觉检测场景。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

相关 ETF

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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