神工股份(688233.SH)拟投资约11.3亿元建设硅零部件新品研发及配套硅材料等项目

智通财经07-07

智通财经APP讯，神工股份(688233.SH)发布公告，公司拟拟投资建设硅零部件新品研发及配套硅材料扩产项目、集成电路制造关键材料研发及产业化项目、封装及微纳光电用硅材料新品研发及产业化项目，投资总额约为11.3亿元。当前半导体产业快速迭代，封装、微纳光电领域硅基材料需求持续扩容，高端硅零部件国产替代空间广阔。公司现有产能与产品品类难以充分覆盖下游客户多元化、高端化采购需求，产能供给、新品研发...

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