TCL科技：公司目前对玻璃基封装领域尚处于前期调研与技术预研阶段

证券之星07-06

证券之星消息，TCL科技(000100)07月06日在投资者关系平台上答复投资者关心的问题。

投资者提问：TCL董秘好！公司子公司2024年展出的玻璃芯基板技术业务发展前景如何？

TCL科技回复：您好！公司目前对玻璃基封装领域尚处于前期调研与技术预研阶段。公司于该领域能否技术落地与实现商业化量产仍存在重大不确定性，对公司现有经营业绩无明显影响，敬请投资者关注相关技术风险，理性看待行业题材热度。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

相关 ETF

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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