博威合金：HPB主体材料为高纯度无氧铜

证券之星07-06

证券之星消息，博威合金(601137)07月06日在投资者关系平台上答复投资者关心的问题。

投资者提问：公司的HPB高纯铜已实现向三星HBM5的小批量供货，后续随着三星HBM6的研发推进，双方是否会签署联合研发协议，提前锁定下一代高规格HBM散热材料的供应份额？

博威合金回复：您好，HPB 主体材料为高纯度无氧铜，依靠铜超高热导率搭建独立导热通道,并非外置散热器，集成在 HBM 堆叠封装内部，埋设于芯片层间 / 基底热源区。这种封装方式对材料没有特殊要求，公司可以供应满足性能要求的材料，核心在于封装环节。目前该业务还处于早期试样阶段，即使送样，样品数量较少，且不是通过终端客户的产品验证，因此现阶段公司无法识别应用在该领域的高纯度无氧铜的出货量、终端客户及详细情况。感谢您的关注和支持！

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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