根据TrendForce集邦咨询最新MLCC产业研究在AI Server加速换代、云端服务供应商（CSP）自研ASIC芯

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根据TrendForce集邦咨询最新MLCC产业研究在AI Server加速换代、云端服务供应商（CSP）自研ASIC芯片持续放量的双重驱动下Murata（村田）、Samsung Electro-Mechanics（三星电机）、Taiyo Yuden（太阳诱电）等三大龙头厂商2026年6月下旬BB Ratio（订单出货比）分别达1.30、1.31、1.25创新高整体MLCC市场BB Ratio也...

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