高测股份：12寸半导体金刚线切片机获头部客户批量订单

证券之星07-06

证券之星消息，高测股份(688556)07月06日在投资者关系平台上答复投资者关心的问题。

投资者提问：公司的光伏硅片加工设备能不能通过改造用于半导体材料切割

高测股份回复：尊敬的投资者您好！公司自2019年开始推出硅基半导体专用金刚线切割设备及金刚线，并持续拓展到蓝宝石及碳化硅等泛半导体领域，重点聚焦半导体切倒磨核心环节，产品矩阵已从单一切割设备延伸至倒角、减薄全环节，实现从单点设备向整线一体化解决方案的升级。公司半导体截断机、切片机、倒角机已形成批量订单，其中12寸半导体金刚线切片机凭借领先的技术优势已获得头部客户批量订单，占据市场绝大部分份额。感谢您的关注。

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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