思瑞浦：CPO等新型光互联架构的发展，对光通信芯片在带宽、功耗、集成度及可靠性等方面提出了更高要求

证券之星07-06

证券之星消息，思瑞浦(688536)07月06日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好，cpo对于afe芯片的要求有何变化？对于afe芯片的需求是减少还是提升？

思瑞浦回复：尊敬的投资者，您好！CPO等新型光互联架构的发展，对光通信芯片在带宽、功耗、集成度及可靠性等方面提出了更高要求。AFE作为光模块中的关键模拟前端器件，其具体需求将与系统架构、技术路线及应用场景密切相关。公司将持续关注相关技术演进趋势，并结合客户需求推进产品研发和迭代。感谢您的关注！

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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