天通股份：蓝宝石在 HBM 领域的核心应用，是作为2.5D/3D 堆叠 / TSV 等工艺用的临时键合载盘

证券之星07-03

证券之星消息，天通股份(600330)07月03日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘，您好，请介绍一下蓝宝石在HBM领域的相关应用，谢谢！

天通股份回复：尊敬的投资者，您好！蓝宝石在 HBM（高带宽内存）领域的核心应用，是作为2.5D/3D 堆叠 / TSV 等工艺用的临时键合载盘，解决超薄晶圆在 HBM 制造中的翘曲、变形与破碎问题，显著提升良率。感谢您的关注！

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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