天赐材料：高温固化型pspi产品处于中试及客户推广阶段

证券之星07-03 09:01

证券之星消息，天赐材料(002709)07月03日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问贵司在半导体材料领域是否有布局？目前是否有相关业务？

天赐材料回复：尊敬的投资者，感谢您的关注，公司前瞻性材料发展平台天赐高研（上海）电子有限公司已完成高温固化型pspi产品的开发并处于中试及客户推广阶段，低温固化及更多相关应用产品也正在开发中；此外，公司也在开发芯片散热用的导热材料，目前处于客户测试中，上述产品目前均尚未产生销售，请投资者注意投资风险。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

相关 ETF

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2648634256?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2026-07-03 09:01","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2648634256","market":"sh","top_or_hot":-1,"title":"天赐材料：高温固化型pspi产品处于中试及客户推广阶段","media":"证券之星","content":"<html><body><p>证券之星消息，<a href=\"https://laohu8.com/S/002709\">天赐材料</a>(002709)07月03日在投资者关系平台上答复投资者关心的问题。</p><p>投资者提问：请问贵司在半导体材料领域是否有布局？目前是否有相关业务？</p><p>天赐材料回复：尊敬的投资者，感谢您的关注，公司前瞻性材料发展平台天赐高研（上海）电子有限公司已完成高温固化型pspi产品的开发并处于中试及客户推广阶段，低温固化及更多相关应用产品也正在开发中；此外，公司也在开发芯片散热用的导热材料，目前处于客户测试中，上述产品目前均尚未产生销售，请投资者注意投资风险。</p><p>本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。</p><h2>相关 ETF</h2><p><img src=\"https://static.stockstar.com/etf/15991520260702.png\"/><img src=\"https://static.stockstar.com/etf/15978120260702.png\"/><img src=\"https://static.stockstar.com/etf/51609020260702.png\"/><img src=\"https://static.stockstar.com/etf/15917520260702.png\"/></p><p>责任编辑：沈彬</p></body></html>","source":"stockstar","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>天赐材料：高温固化型pspi产品处于中试及客户推广阶段</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n天赐材料：高温固化型pspi产品处于中试及客户推广阶段\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-07-03 09:01 北京时间&nbsp;&nbsp;&nbsp;<a href=https://stock.stockstar.com/RB2026070300009307.shtml><strong>证券之星</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>证券之星消息，天赐材料(002709)07月03日在投资者关系平台上答复投资者关心的问题。投资者提问：请问贵司在半导体材料领域是否有布局？目前是否有相关业务？天赐材料回复：尊敬的投资者，感谢您的关注，公司前瞻性材料发展平台天赐高研（上海）电子有限公司已完成高温固化型pspi产品的开发并处于中试及客户推广阶段，低温固化及更多相关应用产品也正在开发中；此外，公司也在开发芯片散热用的导热材料，目前处于...</p>\n\n<a href=\"https://stock.stockstar.com/RB2026070300009307.shtml\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK0077","symbol_name":"质押式回购","start_time":0,"source_url":"https://stock.stockstar.com/RB2026070300009307.shtml","article_id":"2648634256","we_media_id":"1082532455","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2648634256","pubTimestamp":1783040471,"columns":[],"sourceInfo":{"source_id":"stockstar","name":"证券之星"},"weMediaInfo":{"media_name":"证券之星","introduction":"证券之星始创于1996年，是国内领先的金融信息及综合服务平台。关注证券之星，即时获取有价值的财经资讯。","home_visible":1,"id":"1082532455","head_image":"https://community-static.tradeup.com/news/2e305640fc27210243042d09d3a7fa3f"},"summary":"证券之星消息，天赐材料(002709)07月03日在投资者关系平台上答复投资者关心的问题。投资者提问：请问贵司在半导体材料领域是否有布局？目前是否有相关业务？天赐材料回复：尊敬的投资者，感谢您的关注，公司前瞻性材料发展平台天赐高研（上海）电子有限公司已完成高温固化型pspi产品的开发并处于中试及客户推广阶段，低温固化及更多相关应用产品也正在开发中；此外，公司也在开发芯片散热用的导热材料，目前处于客户测试中，上述产品目前均尚未产生销售，请投资者注意投资风险。本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。相关 ETF责任编辑：沈彬","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"zh","relate_stocks":{"BK0077":"质押式回购","LU0543330566.HKD":"TEMPLETON BRIC \"A\" (HKD) ACC","BK0229":"化学制品","LU0708995153.HKD":"TEMPLETON EMERGING MARKETS \"A\" (HKD) ACC","BK0028":"国家队","002709":"天赐材料","LU0229945570.USD":"TEMPLETON BRIC \"A\" (USD) ACC","LU0320764243.SGD":"FTIF - Templeton Emerging Markets A Acc SGD","LU0029874905.USD":"TEMPLETON EMERGING MARKETS \"A\" INC","BK0155":"锂电池","LU0128522744.USD":"TEMPLETON EMERGING MARKETS \"A\" ACC"},"translate_title":"Tianci Materials: High-temperature curing pspi products are in the pilot trial and customer promotion stage","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"002709":1.5},"content_text":"证券之星消息，天赐材料(002709)07月03日在投资者关系平台上答复投资者关心的问题。投资者提问：请问贵司在半导体材料领域是否有布局？目前是否有相关业务？天赐材料回复：尊敬的投资者，感谢您的关注，公司前瞻性材料发展平台天赐高研（上海）电子有限公司已完成高温固化型pspi产品的开发并处于中试及客户推广阶段，低温固化及更多相关应用产品也正在开发中；此外，公司也在开发芯片散热用的导热材料，目前处于客户测试中，上述产品目前均尚未产生销售，请投资者注意投资风险。本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。相关 ETF责任编辑：沈彬","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":true,"editions":null,"column":"","sentiment":"0","news_tag":"productRelease","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"isLaohu8Offline":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.44.1","shortVersion":"4.44.1","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2648634256","isCrawlerRequest":true}