中信建投：全球半导体设备2028市场规模有望较2025翻倍

智通财经07-03

【中信建投：全球半导体设备2028市场规模有望较2025翻倍】中信建投研报预测：2028年全球半导体制造企业资本开支有望达到3417亿美元，较2025年的1681亿美元大幅增长103.3%，实现翻倍。资本开支的大幅上调直接传导至设备端；2028年全球前道半导体设备市场规模达到2414亿美元，较2025年增长约108%；2028年全球后道半导体设备市场规模约383亿美元，较2025年的161.6...

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