蓝箭电子：公司致力于车规级功率器件、芯片级封装及宽禁带半导体器件等先进封装工艺攻关研究

证券之星07-01

证券之星消息，蓝箭电子(301348)06月30日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘你好，公司有没有碳化硅方面的封测技术或者产品

蓝箭电子回复：尊敬的投资者，您好！公司致力于车规级功率器件、芯片级封装及宽禁带半导体器件等先进封装工艺攻关研究，为公司的功率型器件碳化硅SiC等第三代半导体领域储备先进的工艺技术基础。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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