矩子科技：公司半导体封测AOI主要应用于键合、Post Dicing等工艺环节的检测需求

证券之星07-02

证券之星消息，矩子科技(300802)07月01日在投资者关系平台上答复投资者关心的问题。

投资者提问：公司的先进封装检测范围中包含存储芯片检测吗？

矩子科技回复：尊敬的投资者，您好。公司半导体封测AOI主要应用于键合、Post Dicing等工艺环节的检测需求，并不单纯以芯片类别进行划分，主要视产品生产中涉及的工艺环节和具体检测需求是否与公司设备能力相匹配。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：陈思雨

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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