宏明电子：募投项目不涉及晶圆IC芯片制造

证券之星07-03 08:42

证券之星消息，宏明电子(301682)07月02日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司募资项目中，有3.4亿资金用于“新型电子元器件及集成电路生产”，请问集成电路（即IC芯片）生产，是指哪些集成电路芯片？谢谢

宏明电子回复：尊敬的投资者，您好！募投项目“新型电子元器件及集成电路生产”不涉及晶圆IC芯片制造。一期项目核心产品为HTCC陶瓷封装外壳；二期项目核心建设内容为年产 4 亿只高可靠高容体比多层瓷介电容器产能，以巩固公司在高可靠MLCC行业地位。募投项目具体情况请以公司公告为准。感谢您的关注！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：陈思雨

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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