博威合金：公司在AI算力领域已构建覆盖高速连接器、通讯屏蔽、液冷散热及算力供配电四大方向的全链条材料

证券之星06-30

证券之星消息，博威合金(601137)06月30日在投资者关系平台上答复投资者关心的问题。

投资者提问：面向AMD下一代AI芯片的液冷配套需求，公司当前是否已启动相关材料的送样验证工作，后续是否有机会切入AMD的全球AI供应链体系，打开英伟达之外的第二增长曲线？

博威合金回复：您好，公司在AI算力领域已构建覆盖高速连接器、通讯屏蔽、液冷散热及算力供配电四大方向的全链条材料。但公司处于产业链中上游，主要以间接供货模式通过下游连接器厂商、电源系统供应商等将材料导入终端算力整机供应链。公司持续关注全球AI芯片厂商的技术演进与材料需求，并积极推进在下游国际头部连接器厂商、电源模块厂商中的材料验证与导入工作。感谢您的关注和支持！

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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