功率半导体再启阶梯式调价；高通计划将数据中心芯片技术引入智能手机｜数智早参

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丨 2026年6月29日星期一丨　　NO.1 功率半导体再启阶梯式调价　　由于AI（人工智能）算力集群功耗激增，功率半导体正成为存储之后的产业新增长引擎，行业再掀起一轮涨价潮。多位业内人士判断，本轮成本驱动的涨价周期仍将持续一段时间，并且行业将加速功率器件低端产能的出清，市场份额将向具备IDM（垂直整合制造）全链条能力或与上游深度绑定且涉足高景气赛道的头部芯片企业集中。　　点评：此次涨价本质是AI...

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功率半导体再启阶梯式调价　　由于AI（人工智能）算力集群功耗激增，功率半导体正成为存储之后的产业新增长引擎，行业再掀起一轮涨价潮。多位业内人士判断，本轮成本驱动的涨价周期仍将持续一段时间，并且行业将加速功率器件低端产能的出清，市场份额将向具备IDM（垂直整合制造）全链条能力或与上游深度绑定且涉足高景气赛道的头部芯片企业集中。　　点评：此次涨价本质是AI算力爆发下的供需错配。涨价周期将加速行业分化，掌握IDM模式、绑定上游晶圆资源的头部企业，有望借AI东风扩大市场份额。对投资者而言，需关注企业在高压大功率领域的量产能力，但需警惕上游原材料波动及AI算力投资不及预期带来的回调风险。　　NO.2高通计划将数据中心芯片技术引入智能手机　　高通公司执行副总裁杜尔加·马拉迪近日表示，公司计划将本周新发布的数据中心芯片技术应用于智能手机，以提升移动设备本地AI运行能力。高通新推出的高带宽计算（HBC）架构采用芯片垂直堆叠设计，将内存与计算单元紧密集成，可显著提升数据传输速度与效率。该架构第一代产品将于明年在数据中心推出，预计2028年实现商业化供货。　　点评：从行业趋势看，高通这一计划加速了“混合式AI”时代的到来，手机有望取代轻薄本成为移动生产力工具。对于投资者而言，芯片堆叠与先进封装产业链将迎来新的增长极。此外，2028年的商业化节点有望催生移动终端硬件的一次换代周期，值得产业链上下游提前布局。　　NO.3我国已经研制发布40余项人工智能国家标准　　据国家标准委近日介绍，2025年以来，我国已经研制发布40余项人工智能国家标准。在基础支撑领域，发布《人工智能服务器系统性能测试方法》；在关键技术领域，发布《人工智能大模型》系列标准；在产品应用领域，出台《人工智能终端智能化分级》标准。一系列重点标准推动人工智能技术从单点突破走向体系化迭代，有效降低行业研发成本与规模化落地门槛，全方位支撑产业规范有序发展。　　点评：该成果是我国人工智能产业从“野蛮生长”迈向“规范发展”的关键里程碑。标准覆盖底层算力测试、核心技术大模型到终端应用全链条，既为中小企业提供了统一技术参照，降低试错成本，也加速了AI技术在各行业的规模化渗透。对资本市场而言，标准明确将提振投资者对AI赛道的长期信心，引导资源向合规优质企业集聚。（文章来源：每日经济新闻）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":false,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":1,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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