鼎龙股份：主营业务为晶圆制造材料、半导体显示材料、先进封装材料、第三代半导体配套材料及锂电功能性辅材

证券之星06-30

证券之星消息，鼎龙股份(300054)06月30日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问贵司有光芯片材料技术铌酸锂工艺技术是吗

鼎龙股份回复：投资者您好，感谢您的关注。截至目前，公司公开披露的主营业务为晶圆制造材料、半导体显示材料、先进封装材料、第三代半导体配套材料及锂电功能性辅材，未来公司将紧抓行业发展机遇，推动公司已有较成熟的半导体材料产品销售放量；同时结合自身技术储备及资本实力，积极关注并前瞻布局算力、存储、光通信等领域的高端材料。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：陈思雨

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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