晶方科技：公司专注于集成电路先进封装技术

证券之星06-26

证券之星消息，晶方科技(603005)06月26日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好，请问公司目前有NPO光引擎3D异构成封装技术吗？如果有，目前是技术储备阶段还是已经为相关公司提供服务并且进入到小批量出货或者量产阶段了？

晶方科技回复：您好，公司专注于集成电路先进封装技术，尤其在晶圆级TSV先进封装技术领域具备显著领先优势，相关技术在3D堆叠、异质集成等领域具有应用前景，谢谢您的关注！

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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