慧谷新材：应用于LED芯片封装领域的光电涂层材料产品可用于玻璃基板光电封装领域

证券之星06-26

证券之星消息，慧谷新材(301683)06月26日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司是否具备有关玻璃基板方面的产品或技术？

慧谷新材回复：尊敬的投资者，您好！我司应用于LED芯片封装领域的光电涂层材料产品可用于玻璃基板光电封装领域。我司相关产品在该领域暂未形成规模化销售，业务具有不确定性，请广大投资者注意投资风险。谢谢!

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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