宇邦新材：锡膏产品目前主要应用在光伏行业的BC电池组件封装焊接

证券之星06-26

证券之星消息，宇邦新材(301266)06月25日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好，请问公司低温焊接锡膏系列产品，用于的PCB基材吗

宇邦新材回复：尊敬的投资者，您好！公司的锡膏产品目前主要应用在光伏行业的BC电池组件封装焊接，暂未将本产品应用于其他领域，谢谢！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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