瑞丰光电：公司在显示封装领域坚持PCB 基板与玻璃基板双技术路径并行的策略

证券之星06-24

证券之星消息，瑞丰光电(300241)06月23日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司有没有玻璃基板封装技术？

瑞丰光电回复：尊敬的投资者，您好，公司在显示封装领域坚持PCB 基板与玻璃基板双技术路径并行的策略，目前玻璃基封装的技术储备计划适用于差异化的Mini/Micro LED显示应用，MiniLED产品目前主要采用COB方案，感谢您的关注!

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：沈彬

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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