金博股份：已开发半导体晶硅制造用超高纯热场及保温材料等系列产品

证券之星06-24

证券之星消息，金博股份(688598)06月24日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好，公司高纯碳碳热场工艺可降维适配磷化铟、砷化镓等化合物半导体长晶设备，是否有布局，建议横向拓展相关热场耗材；同时依托氮化铝粉体布局光通讯散热基板，低成本拓宽第二增长曲线，请问公司有无相关规划？

金博股份回复：尊敬的投资者您好，公司已开发半导体晶硅制造用超高纯热场及保温材料等系列产品，可满足下游碳化硅衬底制备的热场需求。感谢您的建议和对公司的关注。

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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