伟测科技：基于2.5D封装工艺高性能光计算芯片晶圆测试方案目前正在研发阶段

证券之星06-23

证券之星消息，伟测科技(688372)06月23日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司的子公司威硅半导是不是有涉及CPO等光通信光器件检测领域了测，进展与同行胜科纳米对比如何

伟测科技回复：您好，公司及子公司暂无CPO测试的订单，基于2.5D封装工艺高性能光计算芯片晶圆测试方案目前正在研发阶段。感谢您的关注。

本文数据来源于上海证券交易所e互动，仅供参考不构成投资建议。

相关 ETF

责任编辑：陈思雨

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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